Yong Wang mei.wang@infineon.com & | Head of Process & Technology Development (2010 to 2015) 1. Develop new and disruptive package technologies including new processes and materials. 2. Provide technical solution for new wafer technology, package and process technology development through in-depth knowledge of equipments, materials and processes. Head of Project Management (2015 to 2017) 1. Project management for new packages and new products. 2. Plan resource and budget as well as cost monitoring and controlling for development projects. 3. Skilful in mitigate risks for changes and new technology to ensure success of project. 4. Have excellent project management skill and negotiation skill. 5. Demonstrated significant leadership qualities in multinational project core teams which consist of cross functional team members Head of Package platform (2018 to present) Leading teams of package technology, project management and process development. Additional experiences: Operation including equipment and maintenance experience

Yong Wang

Head of Process & Technology Development (2010 to 2015) 1. Develop new and disruptive package technologies including new processes...

Ayer Keroh, Malacca, Malaysia

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Yong Wang’s Emails [email protected]

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Yong Wang’s Location Ayer Keroh, Malacca, Malaysia

Yong Wang’s Expertise Head of Process & Technology Development (2010 to 2015) 1. Develop new and disruptive package technologies including new processes and materials. 2. Provide technical solution for new wafer technology, package and process technology development through in-depth knowledge of equipments, materials and processes. Head of Project Management (2015 to 2017) 1. Project management for new packages and new products. 2. Plan resource and budget as well as cost monitoring and controlling for development projects. 3. Skilful in mitigate risks for changes and new technology to ensure success of project. 4. Have excellent project management skill and negotiation skill. 5. Demonstrated significant leadership qualities in multinational project core teams which consist of cross functional team members Head of Package platform (2018 to present) Leading teams of package technology, project management and process development. Additional experiences: Operation including equipment and maintenance experience

Yong Wang’s Current Industry Infineon Technologies

Yong Wang’s Prior Industry
Infineon Technologies

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Work Experience

Infineon Technologies

Senior Director, Technology, Process & Material

Sat Jan 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) — Present

Infineon Technologies

Senior Director, Package Development in Logic

Wed Jan 01 2003 00:00:00 GMT+0000 (Coordinated Universal Time) — Present

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FAQ About Yong Wang

Yong Wang is located at
Ayer Keroh, Malacca, Malaysia

Yong Wang is a
Head of Process & Technology Development (2010 to 2015) 1. Develop new and disruptive package technologies including new processes and materials. 2. Provide technical solution for new wafer technology, package and process technology development through in-depth knowledge of equipments, materials and processes. Head of Project Management (2015 to 2017) 1. Project management for new packages and new products. 2. Plan resource and budget as well as cost monitoring and controlling for development projects. 3. Skilful in mitigate risks for changes and new technology to ensure success of project. 4. Have excellent project management skill and negotiation skill. 5. Demonstrated significant leadership qualities in multinational project core teams which consist of cross functional team members Head of Package platform (2018 to present) Leading teams of package technology, project management and process development. Additional experiences: Operation including equipment and maintenance experience Infineon Technologies

Yong Wang currently works in the
Infineon Technologies

Yong Wang specializes in
Head of Process & Technology Development (2010 to 2015) 1. Develop new and disruptive package technologies including new processes and materials. 2. Provide technical solution for new wafer technology, package and process technology development through in-depth knowledge of equipments, materials and processes. Head of Project Management (2015 to 2017) 1. Project management for new packages and new products. 2. Plan resource and budget as well as cost monitoring and controlling for development projects. 3. Skilful in mitigate risks for changes and new technology to ensure success of project. 4. Have excellent project management skill and negotiation skill. 5. Demonstrated significant leadership qualities in multinational project core teams which consist of cross functional team members Head of Package platform (2018 to present) Leading teams of package technology, project management and process development. Additional experiences: Operation including equipment and maintenance experience